3 Article

Single- Multi-layer printed circuit

The world of circuit boards encompasses a wide variety of different constructions. In the rigid circuit board sector, there are numerous variations, including standard FR4 materials with 35 µm copper plating and solder resist with component printing. Furthermore, there are special constructions with aluminum layers that provide optimal temperature distribution, as well as circuit boards with higher copper build-ups up to 105 µm. Laser drillings, special milling in the Z-axis, and different surface finishes such as tin/silver HAL, lead-free, or gold are also available. Multilayer circuit boards offer greater flexibility in circuit development by stacking multiple layers on top of each other, thereby achieving a higher density of signals. They are connected to each other using special adhesives and materials, providing a robust and reliable platform for complex circuits.