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HAL lead free

HAL (Hot Air Level(l)ing) is the most common surface finish. It is very good for standard SMD. With this surface you are not able to realize a homogeneous thickness because the surface will be made by a tin bath. The tin produces drops at the edges of holes and pads so that the surface could be very thin there. So it is suitable for standard SMD but for fine pitch applications, a chemical surface is preferable.

PROS:

  • good shelf life (approx. 12 month)
  • good solderability
  • good reflow capacity
     

CONS:

  • pads are not planar
  • limited usage of fine pitch

Dimensions

HAL (Hot Air Leveling) is the most common surface finish. It is suitable for standard SMD, but a homogeneous thickness cannot be produced with this surface due to the fact that it is built by a tin bath. The tin produces drops at the edges of holes and pads so that the surface can get very thin there. This is the reason why HAL lead free is not suitable for fine pitch applications.

Due to a decrease of the packing factor and a decrease of the interspaces of PINS the HAL surfaces will not satisfy future demands.
 

PROS:

  • long shelf life (approx. 12 months)
  • good solderability
  • good reflow capacity
  • well priced
     

CONS:

  • pads are not planar
  • limited applicability of fine pitch
  • thin surfaces at the edges

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